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I made my own RAM! - Micron Factory Tour

Linus Tech Tips・2 minutes read

Micron's Memory R&D Center in Boise is a state-of-the-art facility where individuals can build their own DDR5 memory kit, part of a larger expansion plan with a $15 billion investment. The final product, 24 gigabyte XMP modules, undergo rigorous testing and validation in collaboration with various industries for unique applications.

Insights

  • Micron's Memory R&D Center in Boise is a state-of-the-art facility with advanced equipment for developing and testing cutting-edge memory technologies, showcasing the company's commitment to innovation and expansion in the semiconductor industry.
  • The intricate process of memory module production at Micron involves detailed steps such as encapsulation, defect detection, precision assembly, and rigorous testing, highlighting the complexity and meticulous nature of creating high-quality memory products that undergo extensive validation procedures for reliability and durability.

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  • What is Micron's Memory R&D Center known for?

    Innovation and cutting-edge silicon development facilities.

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Summary

00:00

Micron's Cutting-Edge Memory Development in Boise

  • Micron's Memory R&D Center in Boise houses over 200,000 square feet of cutting-edge silicon development, fabrication, and testing facilities.
  • Micron sponsored a visit where the individual was allowed to use equipment and build their own DDR5 memory kit for a system upgrade.
  • Boise's main site hosts nearly 9,000 high-tech workers, with plans for a $15 billion investment to expand manufacturing space.
  • Fab Four at Micron's facility contains advanced etching, polishing, and implantation machines for testing new production techniques.
  • Micron is developing upcoming memory nodes, including one gamma and one Delta, with the installation of ASML's extreme ultraviolet lithography system.
  • ASML's extreme ultraviolet lithography system is valued at over $180,000 tons and required three 747s for transportation.
  • Micron utilizes specialized tools like the UF 3000 wafer probing machine for diagnosing nanometer-scale features on silicon.
  • Manual probing is essential for deep investigations into new silicon features, allowing for precise testing beyond what auto probing can achieve.
  • Thinning processes are crucial for preparing wafers for encapsulation, involving grinding and slicing with diamond blades.
  • Encapsulation involves stacking, bonding, and embedding dies into memory modules, followed by rigorous testing on characterization testers and x-ray machines.

16:04

"Automated PCB Production: Crafting Cutting-Edge Memory Modules"

  • Trays of packaged dies are ready for module building using a multi-stage automated PCB production line similar to what Crucial uses.
  • The first stage involves silk screening, where solder paste is applied to memory module PCBs.
  • A defect is detected during the process, leading to the need for a 3D computer vision model to identify and rectify errors like bridging contacts.
  • Attempts to fix defects are made, with the process involving precision work and the use of solder paste from refrigerated tubes.
  • The assembly robots pick surface mount components from reels and place them on memory modules using different heads based on component size.
  • Packaged dies are added to the modules, followed by a process in a specialized oven to ensure proper temperature and soldering.
  • A CNC cutter is used to prepare the modules for computer use, with a focus on precision and correct handling.
  • The modules undergo a validation process in a burn-in lab to test for reliability and durability under extreme conditions for extended periods.
  • Micron collaborates with various industries beyond tech giants, leading to unique and diverse hardware applications.
  • The final memory modules produced are 24 gigabyte XMP modules, a unique and cutting-edge product that undergoes rigorous testing and validation.
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